Semiconductor package assembly
AssigneeMediatek Inc.
InventorsTzu-Hung Lin, I-Hsuan Peng
Life of this patent
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Abstract
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first semiconductor die. A first molding compound surrounds the first semiconductor die. A first redistribution layer (RDL) structure is disposed on a bottom surface of the first molding compound. The first semiconductor die is coupled to the first RDL structure. A second redistribution layer (RDL) structure is disposed on a top surface of the first molding compound. A passive device is coupled to the second RDL structure.
Claims30
A semiconductor package assembly, comprising:
- a first semiconductor package, comprising:
- a first semiconductor die;
- a first molding compound surrounding the first semiconductor die;
- a first redistribution layer (RDL) structure disposed on a bottom surface of the first molding compound, wherein the first semiconductor die is coupled to the first RDL structure;
- a second redistribution layer (RDL) structure disposed on a top surface of the first molding compound;
- and
- a passive device coupled to the second RDL structure.
A semiconductor package assembly, comprising:
- a first semiconductor package, comprising:
- a first redistribution layer (RDL);
- a second redistribution layer (RDL) structure on the first RDL structure;
- a first molding compound having two opposite surfaces in contact with the first RDL structure and the second RDL structure, respectively;
- and
- first vias passing through the first molding compound between the first RDL structure and the second RDL structure;
- and
- a passive device in contact with the second RDL structure and free from contact with the first molding compound.
A semiconductor package assembly, comprising:
- a first semiconductor package, comprising:
- a first molding compound having two opposite surfaces;
- a first redistribution layer (RDL) and a second redistribution layer (RDL) structure on the two opposite surfaces;
- and
- first conductive structures in contact with the first RDL structure and free from contact with the first molding compound;
- and
- a passive device in contact with the second RDL structure and free from contact with the first molding compound.
Dependencies are inferred from the claim text.