Semiconductor module

A semiconductor module comprising:

• a first semiconductor chip including a surface provided with a first signal electrode;
• a second semiconductor chip arranged apart from the first semiconductor chip and including a surface on a first semiconductor chip side provided with a second signal electrode;
• a first signal lead electrically connected to the first signal electrode;
• and
• a second signal lead electrically connected to the second signal electrode,
• wherein
• the first signal lead and the second signal lead are arranged so that a height position of the first signal lead and a height position of the second signal lead match in a height direction that is toward the second semiconductor chip from the first semiconductor chip,
• the surface of the first semiconductor chip provided with the first signal electrode and the surface of the second semiconductor chip provided with the second signal electrode face each other;
• the first wire is connected to a surface of the first signal lead on a second semiconductor chip side, and is curved so as to protrude toward the second semiconductor chip side, and
• the second wire is connected to a surface of the second signal lead on a first semiconductor chip side, and is curved so as to protrude toward the first semiconductor chip side.