Resin-encapsulated semiconductor device and method of manufacturing the same

A resin-encapsulated semiconductor device, comprising:

• a first resin encapsulated body;
• and
• a second resin encapsulated body,
• the first resin encapsulated body comprising:
• a first semiconductor element;
• an external terminal spaced around the first semiconductor element;
• inner wiring for connecting the first semiconductor element and a surface of the external terminal to each other;
• and
• a first resin for covering the first semiconductor element, the external terminal, and the inner wiring,
• wherein a rear surface of the external terminal, a covering layer formed on a rear surface of the first semiconductor element, and a surface of the inner wiring are exposed from the first resin,
• the second resin encapsulated body comprising:
• a second semiconductor element;
• a second resin for covering the second semiconductor element;
• and
• a metal body that is connected to the second semiconductor element, and is partly exposed from the second resin,
• wherein a surface of the first resin encapsulated body on which the inner wiring is exposed and a surface of the second resin encapsulated body on which the metal body is exposed are formed so as to be in intimate contact with each other, and the inner wiring and the metal body are electrically connected to each other.