Back to results
US 2016/0260679 A1Published application
Hybrid interconnect for low temperature attach
AssigneeIntel Corporation
InventorsKabirkumar J. Mirpuri, Hongjin Jiang, Tyler N. Osborn, Rajen S. Sidhu, Ibrahim Bekar, Susheel G. Jadhav
Life of this patent
Estimating the term…
Abstract
Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.
Claims21
An apparatus comprising:
- a substrate having a pad disposed on the substrate;
- a solder ball coupled with the pad, the solder ball including an alloy of tin, silver, and copper;
- and
- a solder paste generally positioned between the pad and the solder ball, the solder paste including the alloy and a low-temperature solder (LTS) with a melting point that is less than or equal to a melting point of the alloy.
1 more element
A method comprising:
- depositing a solder paste on a pad of a substrate, the solder paste including a low-temperature solder (LTS) with a melting point that is less than or equal to 217° Celsius and an alloy of tin, silver, and copper;
- positioning a solder ball including the alloy on the solder paste such that the solder paste is disposed between the pad and the solder ball;
- and
- performing a reflow process at a temperature above the melting point of the LTS and below a melting point of the alloy.
1 more element
An apparatus comprising:
- a substrate with a first side and a second side, a die mounted on the first side and a pad disposed on the first side of the substrate;
- a mold compound coupled with the first side of the substrate, the mold compound having a through-mold via over the pad;
- a solder joint positioned within the through-mold via and coupled with the pad, the solder joint comprising:
- a solder ball comprised of a lead-free alloy;
- and
- a solder paste generally positioned between the substrate and the solder ball, the solder paste including generally equal amounts of the lead-free alloy and a low-temperature solder (LTS) having a melting point that is less than or equal to 175° Celsius, wherein the solder joint is configured to route electrical signals of the die.
3 more elements
Dependencies are inferred from the claim text.