Removal of integrated circuit chips from a wafer
AssigneeGlobalfoundries Inc.
InventorsBradley P. Jones, Thomas W. Dyer
Life of this patent
Estimating the term…
Abstract
Upon a wafer, integrated circuit (IC) chips are separated by a kerf that includes a through kerf via (TKV). The chips are removed from the wafer and separated from each other by removing the TKV. The TKV may be formed simultaneous or subsequent to formation of a through via (TSV) within an active inner region of each IC chip. The TKV reduces wasted area of the wafer allowing for more IC chips to be included thereupon. Further, the TKV allows for IC chips included in the wafer to differ in perimeter geometry.
Claims20
A semiconductor device comprising:
- an active inner region comprising:
- a semiconductor substrate;
- an integrated circuit (IC) device layer formed upon the semiconductor substrate, the IC device layer comprising an integrated circuit device;
- a wiring layer formed upon the IC device layer, the wiring layer comprising wiring making electrical contact with the integrated circuit device, and;
- a kerf region at the perimeter of the active inner region comprising a through kerf via (TKV) extending through the kerf region.
A wafer comprising:
- a plurality of chips, each comprising an active inner region that comprises a semiconductor substrate;
- an integrated circuit (IC) device layer formed upon the semiconductor substrate, the IC device layer comprising an integrated circuit device;
- a wiring layer formed upon the IC device layer, the wiring layer comprising wiring making electrical contact with the integrated circuit device, and;
- a kerf that separates the plurality of chips comprising a through kerf via (TKV).
A semiconductor structure fabrication method comprising:
- forming a semiconductor device upon or within a substrate of a first integrated circuit (IC) chip separated from a second IC chip by a kerf region;
- forming a through kerf via (TKV) extending through the kerf region, and;
- separating the first IC chip from the second IC chip by removing the TKV.
Dependencies are inferred from the claim text.