Method for Increasing Adhesion of Copper to Polymeric Surfaces

A method for depositing a metal layer on a packaged electronic device, the method comprising:

• receiving the packaged electronic device comprising an exposed polymeric surface;
• applying a nitrogen-containing plasma to the exposed polymeric surface;
• depositing, at a first power level, a first metal-containing layer on the exposed polymeric surface after having been activated using the nitrogen-containing plasma;
• and
• depositing, at a second power level, a second metal-containing layer onto the first metal-containing layer,
• wherein the second power level is different from the first power level.

A method for depositing a metal layer on a packaged electronic device, comprising:

• receiving a packaged electronic device comprising an exposed polymeric material;
• activating the exposed polymeric material by treating the exposed polymeric material with a nitrogen-containing plasma;
• depositing, at a first power level, a first metal layer on exposed polymeric material via a physical vapor deposition process, the first metal layer providing electromagnetic shielding for the packaged electronic device;
• and
• depositing, at a second power level, a second metal layer onto the first metal layer,
• wherein the second power level is different from the first power level.