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US 2016/0260662 A1Published application
Systems and Methods for Main Distribution on an Integrated Circuit
AssigneeAvago Technologies General IP (Singapore) Pte. Ltd.
InventorsDonald E. Hawk, Larry Golick, Bei Qi Wang
Life of this patent
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Abstract
Systems, methods, devices, circuits for distributing signals and/or potentials on an integrated circuit.
Claims20
An integrated circuit, the integrated circuit comprising:
- a package die paddle having at least a first side, a second side, and a third side, wherein the first side is adjacent to the second side, and the first side is non-adjacent to the third side;
- a die attached to the die paddle;
- and
- a conductive element extending over the die from the first side to the third side, wherein one end of the conductive element is electrically connected to the package die paddle at a first connection location on the first side, and another end of the conductive element is electrically connected to the package die paddle at a second connection location, and wherein the second connection location is selected from a group consisting of:
- the second side, and the third side.
2 more elements
An integrated circuit, the integrated circuit comprising:
- a die having at least a first side and a second side, wherein the first side is opposite the second side;
- a first package lead disposed closer to the first side than to the second side;
- a second package lead disposed closer to the second side than to the first side;
- and
- a conductive element extending over the die from the first package lead to the second package lead, wherein one end of the conductive element is electrically connected to the first package lead, and another end of the conductive element is electrically connected to the second package lead.
2 more elements
An integrated circuit, the integrated circuit comprising:
- a package die paddle having at least a first side, a second side, and a third side, wherein the first side is adjacent to the second side, and the first side is non-adjacent to the third side;
- a die attached to the die paddle;
- a first package lead disposed adjacent to the first side;
- a second package lead disposed adjacent to a location selected from a group consisting of:
- the second side, and the third side;
- a first conductive element extending over the die from the first side to the third side, wherein one end of the first conductive element is electrically connected to the package die paddle at a first connection location on the first side, and another end of the first conductive element is electrically connected to the package die paddle at a second connection location, and wherein the second connection location is selected from a group consisting of:
- the second side, and the third side;
- and
- a second conductive element extending over the die from the first package lead to the second package lead, wherein one end of the second conductive element is electrically connected to the first package lead, and another end of the second conductive element is electrically connected to the second package lead
6 more elements
Dependencies are inferred from the claim text.