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US 2016/0260660 A1Published application
Electronic device and electronic package thereof
AssigneeDelta Electronics, Inc.
InventorsShiau Shi LIN, Chia Yen LEE, Hsin Chang TSAI
Life of this patent
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Abstract
An electronic package is provided, including a substrate and a semiconductor chip. The substrate has a plurality of substrate pads. The semiconductor chip is mounted on the substrate, wherein the semiconductor chip includes a plurality of chip pads electrically connected to the substrate pads of the substrate respectively, and the substrate pads and the chip pads are both trapezoidal.
Claims35
An electronic package, comprising:
- a substrate having a plurality of substrate pads;
- and
- a semiconductor chip mounted on the substrate, wherein the semiconductor chip comprises a plurality of chip pads electrically connected to the substrate pads of the substrate respectively.
An electronic device, comprising:
- a substrate having a plurality of substrate pads, wherein the substrate comprises a printed circuit board;
- and
- a semiconductor chip mounted on the substrate, wherein the semiconductor chip comprises a plurality of chip pads electrically connected to the substrate pads of the substrate respectively, and the substrate pads and the chip pads are both trapezoidal.
Dependencies are inferred from the claim text.