Method of manufacturing semiconductor package and semiconductor package
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsYuichi MIZAWA, Takeo NAGASE
Life of this patent
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Abstract
In a semiconductor package, surfaces of a die pad, a semiconductor element, a connecting member, and a lead are subjected to a surface treatment with a silane coupling agent. A first surface of a plurality of surfaces of the semiconductor device includes a first region where an organic substance is exposed, and a second region where an inorganic substance is exposed, the first surface being bonded with the connecting member. A bonding strength between the first region and the sealing resin is weaker than a bonding strength between the second region and the sealing resin.
Claims11
A method of manufacturing a semiconductor package, the method comprising, in a following order:
- a mounting step of bonding a semiconductor element onto an upper surface of a die pad;
- a connection step of electrically connecting the semiconductor element and a lead via a connecting member;
- a surface treatment step of performing a surface treatment with a silane coupling agent on surfaces of the die pad, the semiconductor element, the connecting member, and the lead;
- and
- a sealing step of sealing with a sealing resin, the die pad, the semiconductor element, the connecting member, and the lead;
- wherein a first surface of a plurality of surfaces of the semiconductor device includes a first region where an organic substance is exposed, and a second region where an inorganic substance is exposed, the first surface being bonded with the connecting member, and
- a bonding strength between the first region and the sealing resin is weaker than a bonding strength between the second region and the sealing resin.
A semiconductor package comprising:
- a die pad;
- a semiconductor element bonded onto an upper surface of the die pad;
- a lead;
- a connecting member connecting the semiconductor device and the lead;
- and
- a sealing resin sealing the die pad, the semiconductor element, the connecting member, and the lead,
- wherein surfaces of the die pad, the semiconductor element, the connecting member, and the lead are subjected to a surface treatment with a silane coupling agent,
- a first surface of a plurality of surfaces of the semiconductor device includes a first region where an organic substance is exposed, and a second region where an inorganic substance is exposed, the first surface being bonded with the connecting member, and
- a bonding strength between the first region and the sealing resin is weaker than a bonding strength between the second region and the sealing resin.
Dependencies are inferred from the claim text.