Electronic package structure

An electronic package structure comprising:

• a substrate comprising:
• a die pad having die pad top surface and an opposing die pad bottom surface, wherein the die pad comprises a conductive material;
• a plurality of leads laterally spaced apart from the die pad each lead having a lead top surface and an opposing lead bottom surface;
• a substrate encapsulant interposed between the die pad and the plurality of leads, wherein the substrate encapsulant has a substrate top surface and an opposing substrate bottom surface;
• an electronic die electrically coupled to the die pad and the plurality of leads;
• and
• a package body encapsulating the electronic die and the substrate top surface, wherein the substrate bottom surface is exposed to the outside, and wherein the substrate further comprises one or more structural features configured to improve board-level reliability, the one or more features comprising one or more of:
• the die pad and the plurality of leads configured to protrude outward from the substrate bottom surface such that side surfaces of the die pad and the plurality of leads are exposed to the outside,
• conductive bumps disposed on the die pad bottom surface and the lead bottom surfaces, or
• at least one lead comprising:
• a first lead portion exposed to the outside of the substrate bottom surface and defining a first connection point for attaching the electronic package structure to a next level of assembly;
• and
• a second lead portion laterally extending towards the die pad and having a recessed bottom surface encapsulated by the substrate encapsulant, the second lead portion defining a second connection point for attaching to the electronic die, wherein the first connection point is laterally separated from the second connection point.

An electronic package structure comprising:

• a substrate including a die pad and a plurality of leads spaced apart from the die pad;
• an electronic die electrically connected to the die pad and the plurality of leads;
• and
• an encapsulant structure encapsulating the substrate and the electronic die, wherein a bottom surface of the die pad and bottom surfaces of the plurality of leads are exposed to the outside,
• wherein the electronic die is attached to first portions of the plurality of leads to define first connection points, and wherein the plurality of leads comprise second portions attached to the first portions, wherein the second portions are configured to define second connection points for attaching to a next level of assembly, and wherein the first connection points and the second connection points are laterally separated.