Plastic cooler for semiconductor modules

A method of manufacturing a cooling apparatus, the method comprising:

• receiving a plurality of modules by a first singular plastic part, each of the modules comprising a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound;
• attaching a second singular plastic part to a periphery of the first plastic part to form a plastic housing, the plastic housing surrounding a periphery of each module to form a multi-die module, the second plastic part having cutouts which expose the first cooling plates and a sealing structure facing a side of the modules with the first cooling plates;
• and
• filling the sealing structure with a sealing material which forms a water-tight seal around the periphery of each module at the side of the modules with the first cooling plates.

A cooling apparatus, comprising:

• a plurality of discrete modules each of which comprises a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound;
• a first and second plastic housing each of which surrounds a periphery of a different subset of the modules to form separate multi-die modules, each of the plastic housings comprising a first singular plastic part which receives the corresponding subset of modules and a second singular plastic part attached to a periphery of the first plastic part, the second plastic part having cutouts which expose the first cooling plates and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of each module at a side of the modules with the first cooling plates;
• a first cover attached to a periphery of the second plastic part of the first plastic housing so as to form a water-tight seal with the second plastic part of the first plastic housing and an enclosed cavity between the first cover and the second plastic part, the enclosed cavity configured to permit fluid flow over the first cooling plates of each discrete module included in the first plastic housing;
• a second cover interposed between and attached to the first and the second plastic housings, the second cover attached to a periphery of the second plastic part of the second plastic housing so as to form a water-tight seal with the second plastic part of the second plastic housing and an enclosed cavity between the second cover and the second plastic part, the enclosed cavity configured to permit fluid flow over the first cooling plates of each discrete module included in the second plastic housing;
• and
• a third cover attached to a side of the second plastic housing opposite the second cover.