Semiconductor device

A method of making a plurality of semiconductor devices, the method comprising:

• providing an electrically conductive member having a first surface;
• providing a plurality of semiconductor substrates, each substrate comprising:
• a first contact located on a first surface of the substrate, and
• a second contact located on a second surface of the substrate;
• mounting the first surface of each substrate on the first surface of the electrically conductive member for electrical and thermal conduction between the electrically conductive member and the substrate via the first contact;
• and
• dicing the electrically conductive member to form said plurality of semiconductor devices, wherein a respective portion of the electrically conductive member in each device forms an electrically conductive heat sink of the device.