Semiconductor module

Abstract

A semiconductor module, which is mounted on an object for mounting and cooled by a cooler to which cooling medium is supplied, the semiconductor module includes: a package; a plurality of semiconductor elements arranged inside the package; and a temperature sensor provided in a part of the plurality of semiconductor elements. The semiconductor element having the temperature sensor is configured so as to be more adjacent to one edge part of the package than the other semiconductor element. The semiconductor module having the temperature sensor is mounted on the object for mounting such that the semiconductor element having the temperature sensor is located at an uppermost position among the plurality of semiconductor elements.

Dependencies are inferred from the claim text.