Back to results
US 2016/0260644 A1Published application
Electronic package and fabrication method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsLung-Shan Chuang, Ching-Wen Chiang, Tzung-Yen Wu, Chun-Hung Lu
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, including a circuit portion, an electronic element disposed on the circuit portion and a lid member disposed on the circuit portion to cover the electronic element. A separation portion is formed between the lid member and the electronic element. The lid member facilitates to prevent warping of the overall package structure. The invention further provides a method for fabricating the electronic package.
Claims15
An electronic package, comprising:
- a circuit portion having opposite first and second sides;
- at least an electronic element disposed on the first side of the circuit portion;
- and
- a lid member disposed on the first side of the circuit portion to cover the electronic element, wherein a separation portion is formed between the lid member and the electronic element.
1 more element
A method for fabricating an electronic package, comprising the steps of:
- providing a semiconductor structure having a carrier, a circuit portion formed on the carrier and at least an electronic element disposed on the circuit portion, wherein the circuit portion has opposite first and second sides, the electronic element being disposed on the first side of the circuit portion and the second side of the circuit portion being bonded to the carrier;
- disposing a lid member on the first side of the circuit portion to cover the electronic element, wherein a separation portion is formed between the lid member and the electronic element;
- and
- removing the carrier.
1 more element
Dependencies are inferred from the claim text.