Semiconductor device for preventing crack in pad region and fabricating method thereof
AssigneeMagnaChip Semiconductor, Ltd.
InventorJong-yeul JEONG
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Abstract
A semiconductor device which prevents a crack from occurring on a pad region is provided. The semiconductor device includes a lower pad, an upper pad which is formed above the lower pad, an insulation layer which is formed between the lower pad and the upper pad, a via net for electrically connecting the lower pad and the upper pad in the insulation layer, the via net having a net shape in which a unit grid is connected with its adjacent unit grids to form a net structure, and at least one via hole for electrically connecting the lower pad and the upper pad in the unit grid of the via net.
Claims11
A method for fabricating a semiconductor device, comprising:
- forming a lower pad;
- forming an insulation layer on the lower pad;
- forming a via net which has a net shape in which a unit grid is connected with its adjacent unit grids to form a net structure in the insulation layer and at least one via hole in the unit grid;
- and
- forming an upper pad on the via net.
Dependencies are inferred from the claim text.