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US 2016/0260625 A1Published application
Polishing device and polishing method
AssigneeKabushiki Kaisha Toshiba
InventorsMasayoshi ADACHI, Jun TAKAYASU
Life of this patent
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Abstract
According to one embodiment, a polishing device includes a stage holding a wafer, a polishing part polishing a film formed on a circumferential edge portion of the wafer, a detector detecting a residual portion of the film on the circumferential edge portion, a first movable part moving the detector along a surface of the circumferential edge portion; and a controller controlling the polishing part based on a state of the circumferential edge portion detected by the detector.
Claims20
A polishing device comprising:
- a stage holding a wafer;
- a polishing part polishing a film formed on a circumferential edge portion of the wafer;
- a detector detecting a residual portion of the film on the circumferential edge portion;
- a first movable part moving the detector along a surface of the circumferential edge portion;
- and
- a controller controlling the polishing part based on a state of the circumferential edge portion detected by the detector.
3 more elements
A polishing method comprising:
- polishing a film deposited onto a circumferential edge portion of a wafer;
- detecting a residual portion of the film on the circumferential edge portion after polishing the wafer;
- and
- selectively re-polishing the circumferential edge portion based on results of the detection.
1 more element
A polishing method comprising:
- detecting a residual portion of a film deposited onto a circumferential edge portion of a wafer and selectively polishing the residual portion.
Dependencies are inferred from the claim text.