Method and Apparatus for Planarization of Substrate Coatings

An apparatus for forming a coating, the apparatus comprising:

• a coating chamber having a platen configured to hold a substrate;
• a first nozzle configured to deliver a first coating in a liquid state to the substrate, the substrate having a non-planar top surface, the coating chamber configured to first dry the first coating, wherein the platen is configured to spin the substrate at a first speed during delivery of the first coating to the substrate, the platen further configured to spin the substrate at a second speed during first drying of the first coating;
• and
• a second nozzle configured to deliver a solvent to the first coating after first drying to re-liquefy the first coating, a top surface of the first coating achieving a substantially planar state after application of the solvent, the coating chamber further configured to second dry the first coating after delivery of the solvent, the first coating having a substantially planar top surface after second drying, wherein the top surface of the first coating is planarized prior to second drying the first coating.

A device for applying a coating, the device comprising:

• a chamber having:
• a platen configured to hold a wafer, the wafer having a plurality of topographical features disposed thereon;
• a first nozzle configured to deliver a first coating over the plurality of topographical features, the chamber configured to first dry the first coating to a solid state, wherein the platen is configured to spin the wafer at a first speed during delivery of the first coating, the platen further configured to spin the wafer at a second speed during first drying of the first coating;
• and
• a second nozzle configured to deliver a solvent to the first coating after first drying to re-liquefy the first coating, the chamber further configured to second dry the first coating after delivery of the solvent, the first coating having a substantially planar top surface after second drying.