US 2016/0260586 A1 · DRY ETCHING DEVICE AND DRY ETCHING METHOD

Abstract

The present disclosure disclosed a dry etching device, comprising an etching cavity; a gas extraction system arranged on the bottom of the etching cavity, wherein, the system includes a gas passage, a gas extractor; controllable valves, each mounted on a respective gas inlet. The present disclosure disclosed a dry etching method, including the steps of: placing a workpiece to be etched on a base platform in an etching cavity; selecting a gas extraction mode from a group consisting of a circulatory working mode and a non-circulatory working mode according to procedures to be performed; performing a dry etching procedure while extracting gas under the circulatory mode or non-circulatory mode. The device can improve the uniformity of the dry etching process and the substrate to be manufactured, thus increase the quality of the product. In addition, the restriction to the design of the product due to the considerations of the uniformity can be reduced, and thus enlarge the room for designing the products.

Claims12

Dependent claims

A dry etching device, comprising:

an etching cavity, including a base platform for placing a workpiece to be etched thereon;
and
a gas extraction system arranged on the bottom of the etching cavity for controlling the movement of gas flow in the etching cavity, wherein the gas extraction system includes:
a gas passage provided with a plurality of gas inlets and a gas outlet, the gas inlets extending into the cavity through an opening located on the bottom of the cavity;
a gas extractor arranged in the gas passage and adjacent to the gas outlet;
and
controllable valves, each mounted on a respective gas inlet and configured to be opened/closed according to setting parameters;
wherein the gas extraction system operates in a circulatory working mode or a non-circulatory working mode, and
under the circulatory working mode, the controllable valves are sequentially opened/closed at a certain time interval so as to control the flow direction of etching gas in the cavity, so that average densities of the etching gas flowing through the workpiece to be etched and thus contacting with different positions of the workpiece to be etched in a specific procedure are consistent.

6 more elements

Dependencies are inferred from the claim text.

Dry etching device and dry etching method

Life of this patent

Dry etching device and dry etching method

Life of this patent

Abstract

Claims12