High Density Multi-Fiber Bundle and Method of Alignment for Fiber Optic Interconnection Applications
OwnerMichel Yvon Rondeau, Richard F.M. Laminventors
Life of this patent
Estimating the term…
Loading patent…
OwnerMichel Yvon Rondeau, Richard F.M. Laminventors
Estimating the term…
A new fiber optic bundle with new features, designs and manufacturing processes, specifically related to the configurations and the special manufacturing methods of High Density Multi-fiber Bundles for fiber optic interconnection applications has been developed for 19 fibers and 37 fibers. Fiber bundles greater than 37 fibers are also included. The Bundle [A] and Bundle [B] Pigtails for multi-fiber connectors or device applications are used in pairs. The 19 or 37-fiber Bundle Pigtail Pairs are concentric to the outside diameter of a metal ferule. The individual fibers in the Pigtails are numbered according to the fiber orientation. The orientation of the fibers in Bundle [A] must be clockwise and the orientation of the fibers in Bundle [B] must be counterclockwise. For device application such as fiber optics splitters, MEMs, and optical switches, a single bundle is aligned and attached to the chip.
The layers in each bundle are divided in ODD and EVEN where the EVEN layers are shifted by the Shift Angle (SA). (See Equation 8.9 and FIG. (8.1). The ODD layers DO NOT shift.
The EVEN layers in the bundle will be shifted either to clockwise (right) or counterclockwise (left) of the ODD layers. See FIG. (6.3).
Dependencies are inferred from the claim text.