Capacitive Sensors for Electronic Devices and Methods of Forming the Same
AssigneeApple Inc.
InventorsTyler S. Bushnell, Vikram Garg
Life of this patent
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Abstract
Capacitive sensor assemblies for electronic devices, and methods of forming capacitive sensor assemblies. The capacitive sensor assembly may include a top component having an intermediate layer formed on the top component, a bottom component positioned opposite the top component, a silicone layer positioned between the top component and the bottom component, and a first electrical trace positioned adjacent the silicone layer.
Claims23
A method of manufacturing a capacitive sensory assembly in an electronic device, the method comprising:
- coupling a silicone layer to a bottom portion of a housing of the electronic device;
- positioning a first electrical trace within a flex layer, the flex layer positioned on the silicone layer, opposite the bottom portion of the housing;
- curing the silicone layer to the flex layer including the first electrical trace;
- applying an adhesive to the flex layer including the first electrical trace, opposite the silicone layer;
- and
- coupling a cover of the electronic device to the flex layer using the applied adhesive.
A method of manufacturing a capacitive sensory assembly in an electronic device, the method comprising:
- coupling an intermediate layer on a at least a portion of an inner surface of a cover of the electronic device;
- etching a portion of the intermediate layer to form a first electrical trace in the etched portion;
- positioning a silicone layer between the intermediate layer and a bottom portion of a housing of the electronic device;
- and
- curing the silicone layer to the intermediate layer including the first electrical trace.
An electronic device comprising:
- a housing comprising:
- a top portion;
- and
- a bottom portion coupled to the top portion;
- and
- a capacitive sensor assembly positioned within the housing, the capacitive sensor comprising:
- a silicone layer positioned between the top portion and the bottom portion of the housing;
- a flex layer coupled to the silicone layer;
- and
- a first electrical trace positioned within the flex layer.
An electronic device comprising:
- a housing;
- a cover glass coupled to the housing;
- an intermediate layer formed on an inner surface of the cover glass;
- and
- a capacitive sensor assembly positioned between the housing and the cover glass, the capacitive sensor comprising:
- a silicone layer coupled to the intermediate layer formed on the inner surface of the cover glass;
- and
- a first electrical trace positioned within the intermediate layer, adjacent the silicone layer.
Dependencies are inferred from the claim text.