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US 2016/0258977 A1Published application
Physical quantity sensor, manufacturing method thereof, electronic equipment, and movable body
AssigneeSeiko Epson Corporation
InventorAtsuki NARUSE
Life of this patent
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Abstract
A physical quantity sensor includes: a base; a cover; a function element provided inside a cavity formed by the base and the cover; and a protection film with which a principal surface of the base, a bonding boundary portion between the principal surface of the base and the cover, and the cover are coated continuously, wherein the protection film is an inorganic material film or an organic semiconductor film.
Claims13
A physical quantity sensor, comprising:
- a base;
- a cover;
- a function element provided inside a cavity formed by the base and the cover;
- and
- a protection film with which a principal surface of the base, a bonding boundary portion between the principal surface of the base and the cover, and the cover are coated continuously,
- wherein the protection film is an inorganic material film or an organic semiconductor film.
3 more elements
A method for manufacturing a physical quantity sensor that includes a function element provided inside a cavity formed by a base and a cover, comprising:
- bonding the base and the cover to each other to house the function element inside the cavity;
- and
- forming a protection film with which a principal surface of the base, a bonding boundary portion between the principal surface of the base and the cover, and the cover are coated continuously,
- wherein the protection film is an inorganic material film or an organic semiconductor film.
1 more element
Dependencies are inferred from the claim text.