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US 2016/0258061 A1Published application
Apparatus to improve substrate temperature uniformity
AssigneeApplied Materials, Inc.
InventorsCHENG-HSIUNG TSAI, YOUQUN DONG, MANJUNATHA KOPPA
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Abstract
Apparatus for improving substrate temperature uniformity in a substrate processing chamber are provided herein. In some embodiments, a cover plate for a substrate processing chamber includes: an outer portion; and a raised inner portion having a thermally emissive layer, wherein a thermal emissivity of the thermally emissive layer varies across the thermally emissive layer.
Claims20
A cover plate for a substrate processing chamber, comprising:
- an outer portion;
- and
- a raised inner portion having a thermally emissive layer, wherein a thermal emissivity of the thermally emissive layer varies across the thermally emissive layer.
A cover plate for a substrate processing chamber, comprising:
- an outer portion;
- a raised inner portion having a plurality of features;
- a central opening disposed through the cover plate;
- and
- one or more thermally emissive elements having a plurality of corresponding features to removably couple the one or more thermally emissive elements to the raised inner portion to form a thermally emissive layer about the central opening, wherein portions of the thermally emissive layer have different thermal emissivities.
2 more elements
A substrate processing chamber, comprising:
- a substrate support having substrate receiving surface and a shaft to support the substrate receiving surface;
- and
- a cover plate disposed about the shaft of the substrate support beneath the substrate receiving surface and having a thermally emissive layer to reflect heat toward the substrate receiving surface, wherein a thermal emissivity of the thermally emissive layer varies across the thermally emissive layer.
Dependencies are inferred from the claim text.