Semiconductor manufacturing apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsKoji Nakahara, Kazuhiro Matsuo
Life of this patent
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Abstract
A semiconductor manufacturing apparatus in this embodiment includes a reactor, a pump, an exhaust pipe and a mesh member. The reactor houses a semiconductor substrate to treat the semiconductor substrate. The pump exhausts a gas inside the reactor. The exhaust pipe connects between the reactor and the pump. The mesh member is located at a flow inlet of the pump for the gas or in the exhaust pipe and has a main plane having a plurality of meshes arranged thereon. The mesh member has a protrusion and/or protruding shape projecting upstream of the gas.
Claims20
A semiconductor manufacturing apparatus comprising:
- a reactor that houses a semiconductor substrate to treat the semiconductor substrate;
- a pump that exhausts a gas inside the reactor;
- an exhaust pipe that connects between the reactor and the pump;
- and
- a mesh member that is located at a flow inlet of the pump for the gas or in the exhaust pipe and has a main plane having a plurality of meshes arranged thereon, the mesh member having a protrusion and/or protruding shape projecting upstream of the gas.
A semiconductor manufacturing apparatus comprising:
- a reactor that houses a semiconductor substrate to treat the semiconductor substrate;
- a pump that exhausts a gas inside the reactor;
- an exhaust pipe that connects between the reactor and the pump;
- and
- a mesh member that is located at a flow inlet of the pump for the gas or in the exhaust pipe and has a main plane having a plurality of meshes arranged thereon, the main plane being divided into a plurality of divided faces so as to make a gap in a flowing direction the gas.
Dependencies are inferred from the claim text.