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US 2016/0257865 A1Published application
Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads
AssigneeXerox Corporation
InventorsYanjia Zuo, Mandakini Kanungo, Hong Zhao, John R. Andrews, Pratima Gattu Naga Rao, Mark A. Cellura, Santokh S. Badesha
Life of this patent
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Abstract
An adhesive compound can include an uncured epoxy film having a curing temperature between about 80° C. and about 300° C. The uncured epoxy film can include a cresol novolac epoxy resin and a bisphenol A epoxy resin. The uncured epoxy film can have a thickness between about 0.1 mil and about 5 mil.
Claims20
An adhesive compound, comprising:
- an uncured epoxy film having a curing temperature between about 80° C. and about 300° C., the uncured epoxy film comprising
- a cresol novolac epoxy resin, and
- at least one bisphenol A epoxy resin
- wherein the uncured epoxy film comprises a thickness between about 0.1 mil and about 5 mil, and
- wherein a chemical structure of the cresol novolac epoxy resin is:
- wherein n represents the number of repeating segments, and is a number of from about 1 to about 30.
3 more elements
A method, comprising:
- forming an epoxy adhesive by curing an adhesive compound, wherein the adhesive compound comprises an uncured epoxy film having a thickness between about 0.1 mil and about 5 mil and a curing temperature between about 80° C. and about 300° C., wherein the uncured epoxy film comprises
- a cresol novolac epoxy resin, and
- at least one bisphenol A epoxy resin,
- wherein a chemical structure of the cresol novolac epoxy resin is:
- wherein n represents the number of repeating segments, and is a number of from about 1 to about 30.
2 more elements
Dependencies are inferred from the claim text.