Electromechanical system substrate attachment for reduced thermal deformation

A method of manufacturing a micro-electromechanical system (MEMS) switch, the method comprising:

• providing a substrate;
• and
• forming a switch structure on the substrate via a wafer level bonding process, wherein forming the switch structure further comprises:
• forming a conductive contact on the substrate;
• forming a self-compensating anchor structure;
• and
• attaching a cantilevered beam to the self-compensating anchor structure to position the cantilevered beam relative to the substrate and the conductive contact, the cantilevered beam comprising a cantilevered portion at an end thereof opposite the self-compensating anchor structure;
• wherein the self-compensating anchor structure is arranged orthogonally to the cantilevered portion of the cantilevered beam, with the cantilevered portion extending out so as to be spaced apart from the substrate and positioned above the conductive contact;
• and
• performing an annealing process on the substrate and the switch structure to achieve bonding in the MEMS switch;
• wherein the cantilevered portion of the beam undergoes deformation during the annealing process responsive to a strain mismatch between the substrate and the switch structure, such that the cantilevered portion has a takeoff angle relative to the substrate;
• and
• wherein the self-compensating anchor structure directs a portion of a strain resulting from the strain mismatch orthogonal to the cantilevered portion so as to warp the anchor structure and compensate for the takeoff angle of the cantilevered portion.

A micro-electromechanical system (MEMS) switch comprising:

• a substrate;
• and
• a switch structure formed on the substrate, the switch structure comprising:
• a conductive contact formed on the substrate;
• an anchor structure coupled to the substrate;
• and
• a beam integrated with the anchor structure and extending out orthogonally therefrom, the beam comprising a cantilevered portion suspended over the substrate and positioned above the conductive contact;
• wherein the anchor structure comprises a self-compensating anchor structure that causes the cantilevered portion to remain undeflected when subjected to thermally induced takeoff angle deformation.