Mission agnostic space vehicle

A payload compartment for a space vehicle, comprising:

• a pressurized structure having a structural wall, the structural wall having interior surfaces facing an interior of the payload compartment and exterior surfaces exposed to an external environment;
• a payload electronic component provided within the payload compartment;
• and
• mounting features supporting the payload electronic component from the pressurized structure,
• wherein the payload electronic component is spaced away from the interior surfaces of the pressurized structure, and
• wherein a thermal fluid is provided in the pressurized structure, the thermal fluid enabling convective heat transfer between the payload electronic component and the interior surfaces of the pressurized structure.

A space vehicle, comprising:

• a pressurized spacecraft bus for enclosing bus components required for a mission;
• and
• a pressurized payload compartment connected to the spacecraft bus,
• wherein the pressurized spacecraft bus comprises:
• a first pressurized structure having a first structural wall;
• a first internal mounting structure for mounting the bus components within the first pressurized structure;
• and
• first mounting features supporting the first internal mounting structure from the first pressurized structure,
• wherein the pressurized payload compartment comprises:
• a second pressurized structure having a second structural wall;
• a payload electronic component provided within the second pressurized structure, the payload electronic component spaced away from the second pressurized structure;
• and
• second mounting features supporting the payload electronic component from the second pressurized structure, and
• wherein a first thermal fluid is provided in the first pressurized structure and a second thermal fluid is provided in the second pressurized structure, the first thermal fluid enabling convective heat transfer between the bus component and the first pressurized structure, the second thermal fluid enabling convective heat transfer between the payload electronic component and the second pressurized structure.