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US 2016/0257131 A1Published application
Compliant micro device transfer head
AssigneeApple Inc.
InventorsAndreas Bibl, John A. Higginson, Hsin-Hua Hu
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Abstract
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
Claims18
An electrostatic transfer method comprising:
- positioning an array of compliant electrostatic transfer heads over an array of micro devices;
- contacting the array of micro devices with the array of compliant electrostatic transfer heads;
- sensing contact of the array of micro devices with the array of compliant electrostatic transfer heads;
- applying a voltage to the array of compliant electrostatic transfer heads to create a grip pressure for each compliant electrostatic transfer head;
- picking up the array of micro devices with the array of compliant electrostatic transfer heads;
- and
- releasing the array of micro devices onto a receiving substrate.
4 more elements
Dependencies are inferred from the claim text.