Back to results
US 2016/0257117 A1Published application
Encapsulating a Bonded Wire with Low Profile Encapsulation
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie, Zhuqing Zhang
Life of this patent
Estimating the term…
Abstract
Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
Claims15
An apparatus for encapsulating a bonded wire with low profile encapsulation, comprising:
- a bonded wire connected to a die on a first end and to a circuit component on a second end;
- and
- an encapsulation material disposed over said bonded wire;
- wherein said encapsulation comprises a truncated shape.
1 more element
A method for encapsulating a bonded wire with low profile encapsulation, comprising:
- applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end;
- and
- truncating a shape of said encapsulation to form a truncated shape.
A printer for encapsulating a bonded wire with low profile encapsulation, comprising:
- a bonded wire with a first end connected to a die that incorporates an inkjet nozzle, a second end of said bonded wire is connected to a circuit component;
- and
- an encapsulation material disposed over said bonded wire;
- wherein said encapsulation comprises a truncated shape that has a profile that is less than a hundred microns in height.
1 more element
Dependencies are inferred from the claim text.