Electronic device manufacturing method and electronic device
AssigneeSeiko Epson Corporation
InventorsNaoya SATO, Masashi YOSHIIKE
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Abstract
An electronic device is manufactured by a method including applying a photosensitive adhesive agent either to a pressure chamber forming substrate and a vibrating plate or to a sealing plate having a structure of a lower height from a bonding surface, precuring the photosensitive adhesive agent by heating, patterning the precured photosensitive adhesive agent, and bonding the substrates together with the structure (bump electrode) and the photosensitive adhesive agent interposed therebetween.
Claims4
A manufacturing method of an electronic device that includes a first substrate including a flexurally deformable driving region and a drive element disposed in the driving region so as to deform the driving region, and a second substrate opposed to the first substrate with a spacing from the first substrate and with the drive element and other structure of the first substrate interposed between the first and second substrates, the first and second substrates being bonded together via a thermosetting adhesive agent, the manufacturing method comprising:
- applying the adhesive agent to a bonding surface of one of the first substrate and the second substrate that, on an assumption that the adhesive agent is applied to the both substrates so as to cover a structure formed on the respective bonding surfaces, makes a distance of a slope from a top portion of the adhesive agent covering the structure to an edge of a flat region of the adhesive agent shorter;
- and
- bonding the first substrate and the second substrate together, with the structure and the adhesive agent interposed between the first and second substrates.
Dependencies are inferred from the claim text.