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US 2016/0256962 A1Published application
Lead-free solder having low melting point
AssigneeMk Electron Co., Ltd.
InventorsHui Joong KIM, Jae Hun SONG, Young Woo LEE, Jae Hong LEE, Jae Yeol SON, Eung Jae KIM, Ho Gun CHA
Life of this patent
Estimating the term…
Abstract
A solder ball includes about 1.0 wt % to about 2.0 wt % silver (Ag), about 4.0 wt % to about 8.0 wt % indium (In), about 10.0 wt % to about 20.0 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % deoxidizer, and the balance of tin (Sn). A melting point of the solder is about 170° C. to about 190° C.
Claims12
A solder comprising:
- about 1.0 wt % to about 2.0 wt % silver (Ag);
- about 4.0 wt % to about 8.0 wt % indium (In);
- about 10.0 wt % to about 20.0 wt % bismuth (Bi);
- about 0.005 wt % to about 0.1 wt % deoxidizer;
- and
- the balance of tin (Sn),
- wherein a melting point of the solder is about 170° C. to about 190° C.
4 more elements
A semiconductor package comprising a solder ball, the solder ball comprising:
- about 1.0 wt % to about 2.0 wt % silver (Ag);
- about 4.0 wt % to about 8.0 wt % indium (In);
- about 10.0 wt % to about 20.0 wt % bismuth (Bi);
- about 0.005 wt % to about 0.1 wt % deoxidizer;
- and
- the balance of tin (Sn),
- wherein a melting point of the solder is about 170° C. to about 190° C.
4 more elements
Dependencies are inferred from the claim text.