Polishing and brushing techniques for cylindrical and contoured surfaces
AssigneeApple Inc.
InventorsDemetrios B. KARANIKOS, Wayne H. COWAN, Paul J. THOMPSON, Cheuk Nang HO
Life of this patent
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AssigneeApple Inc.
InventorsDemetrios B. KARANIKOS, Wayne H. COWAN, Paul J. THOMPSON, Cheuk Nang HO
Estimating the term…
Material removal processes of a structure are disclosed. These processes can define several features. For example, metal structure can include an interior recess surrounded by a sidewall. The structure can further include a base portion integrally formed with the sidewall. The sidewall can include an opening extending through the sidewall and into the interior recess. The sidewall can undergo a material removal process to include multiple curved regions. The sidewall, the first curved region, and the second curved region can be polished to include a reflectivity different than a reflectivity of an exterior region of the base portion. A single multi-axes lathe having multiple spindles performs several material removal processes under a continuous machine cutting process. The spindles may include clamping features that allow a first spindle to perform a first operation then pass the metal structure to a second spindle. Additional processes include lapping, polishing, and linear brushing.
A cutting and machining method operable by a multi-axis lathe tool having multiple spindles, each of which is configured to secure a substrate, the cutting and machining method comprising:
A cutting apparatus suitable for cutting a substrate used to form an enclosure feature used with an inductive charging station having an inductive coil, the cutting apparatus comprising:
A non-transitory computer readable storage medium storing instructions that, when executed by a processor, cause the processor to implement a method for cutting and machining a substrate, the method comprising:
Dependencies are inferred from the claim text.