Systems, devices and methods related to stacked band selection switch devices

A method for fabricating a radio-frequency (RF) module, the method comprising:

• obtaining a packaging substrate configured to receive a plurality of components;
• mounting a power amplifier (PA) die on the packaging substrate;
• mounting an output matching network (OMN) device on the packaging substrate;
• interconnecting the PA die and the OMN device;
• and
• stacking a band selection switch on the OMN device.

A wireless device comprising:

• a transceiver configured to generate a radio-frequency (RF) signal;
• a front-end module (FEM) in communication with the transceiver, the FEM including a packaging substrate configured to receive a plurality of components, the FEM further including a power amplifier (PA) assembly implemented on a PA die mounted on the packaging substrate, the PA assembly configured to amplify the RF signal, the FEM further including an output matching network (OMN) device mounted on the packaging substrate and configured to provide output matching functionality for at least a portion of the PA assembly, the FEM further including a band selection switch device mounted on the OMN device;
• and
• an antenna in communication with the FEM and configured to transmit the amplified RF signal.