Led package and method of manufacturing the same

A method of manufacturing a light emitting diode package base comprising:

• providing a metal core substrate having a top surface, a bottom surface, and side surfaces;
• forming two first trenches in the metal core substrate, the first trenches extending from the top surface to the bottom surface;
• at least partially filling the first trenches with first dielectric material to form dielectric isolations, the dielectric isolations dividing the metal core substrate into three metal core portions, wherein two of the metal core portions serve as light emitting diode package electrodes and the side surfaces of the metal core substrate, the dielectric isolations comprising a first dielectric material;
• applying a second dielectric material to cover at least a portion of the first dielectric material;
• and
• forming a conductive layer over the second dielectric material to form circuit contacts, the conductive layer including a first conductive material.