Light emitting device, lead frame and resin cavity molding package

A light emitting device comprising:

• a resin cavity molding package having resin and integrally molded lead frames each constituting an electrode,
• wherein at least one of the lead frames has a retention section extending from said at least one of the lead frames towards an outer surface of the resin cavity molding package,
• wherein a periphery of the retention section is surrounded by the resin,
• wherein the retention section has a cut and exposed plane that is coplanar with the outer surface of the resin cavity molding package,
• wherein a part or all of cut and exposed plane corner parts of retention section of the lead frames is rounded off;
• and
• one or a plurality of light emitting elements that emit light mounted in the resin cavity molding package;
• wherein each light emitting element is mounted on a first lead frame that constitutes a first electrode, and conductively connected to a second electrode.