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US 2016/0254397 A1Published application
Optoelectronic modules with optics integrated into a cap
AssigneeHeptagon Micro Optics Pte. Ltd.
InventorsTobias Senn, Hartmut Rudmann
Life of this patent
Estimating the term…
Abstract
Optoelectronic modules for light emitting and/or light sensing include optical assemblies and active optoelectronic components. An optical assembly and a corresponding optoelectronic component can be aligned. The optoelectronic modules can include multiple optical assemblies and active optoelectronic components. Multiple optical assemblies and corresponding active optoelectronic components can be aligned independently of each other in various implementations of optoelectronic modules that include alignment features and optical assembly barrels.
Claims19
An optoelectronic module comprising:
- a substrate on which are mounted a first active optoelectronic component and a second active optoelectronic component, each of which is configured to emit or detect light at a particular one or more wavelengths;
- a first optical assembly barrel including a first optical assembly over the first active optoelectronic component, wherein the first optical assembly barrel is laterally surrounded by a second optical barrel assembly;
- the second optical barrel assembly including a second optical assembly over the second active optoelectronic component, wherein the second optical assembly is surrounded laterally by sections of the second optical barrel assembly that are substantially non-transparent to the one or more wavelengths of light;
- a first alignment feature separating the first optical assembly barrel from the substrate, wherein the first alignment feature establishes a first assembly dimension with respect to the first optical assembly independent of a second assembly dimension;
- a second alignment feature separating the second optical barrel assembly from the substrate, wherein the second alignment feature establishes the second assembly dimension with respect to the second optical assembly.
2 more elements
An optoelectronic module comprising:
- a substrate on which are mounted a first active optoelectronic component, a second active optoelectronic component, and a third active optoelectronic component, each of which is configured to emit or detect light at a particular one or more wavelengths;
- a first optical assembly barrel including a first optical assembly over the first active optoelectronic component, wherein the first optical assembly barrel is laterally surrounded by a second optical barrel assembly;
- the second optical barrel assembly including a second optical assembly over the second active optoelectronic component and a third optical assembly over the third active optoelectronic component, wherein the second optical assembly and the third optical assembly are surrounded laterally by sections of the second optical barrel assembly that are substantially non-transparent to the one or more wavelengths of light;
- a second alignment feature separating the second optical barrel assembly from the substrate, wherein the second alignment feature establishes a second assembly dimension with respect to the second optical assembly and a third assembly dimension with respect to the third optical assembly;
- a first alignment feature separating the first optical assembly barrel from the substrate, wherein the first alignment feature establishes a first assembly dimension with respect to the first optical assembly independent of the second and third assembly dimensions.
2 more elements
A method of manufacturing an optoelectronic module, the method comprising:
- applying a first optical beam to a second optical assembly laterally surrounded by sections of a second optical barrel assembly having a first alignment feature;
- adjusting a height of the first alignment feature to attain a specified value for a first assembly dimension with respect to the second optical assembly;
- applying a second optical beam to a first optical assembly integrated in a first optical assembly barrel;
- adjusting a height of at least one feature of the first optical assembly or of the first optical assembly barrel to attain a specified value for a second assembly dimension with respect to the first optical assembly;
- mounting the first optical assembly barrel including the first optical assembly over a first active optoelectronic component such that a surface of a second alignment feature of the first optical assembly barrel is in direct or indirect contact with a surface of the first active optoelectronic component;
- and
- mounting the second optical barrel assembly, including the second optical assembly, over a substrate on which the first active optoelectronic component is mounted such that a surface of the first alignment feature is in direct or indirect contact with a surface of the substrate.
4 more elements
A method of positioning a first optical assembly within an optical barrel assembly having a through-hole therein and an edge surface to support the optical assembly, the method comprising:
- applying a probe beam while moving a test optical assembly within the through-hole and determining a position for the first optical assembly;
- adjusting a height of the edge surface;
- and
- inserting the first optical assembly into the optical barrel assembly such that the first optical assembly is supported by the edge surface.
1 more element
Dependencies are inferred from the claim text.