Semiconductor device and method of manufacturing the same
AssigneeToyoda Gosei Co., Ltd.
InventorsKazuya Hasegawa, Tohru Oka, Nariaki Tanaka
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AssigneeToyoda Gosei Co., Ltd.
InventorsKazuya Hasegawa, Tohru Oka, Nariaki Tanaka
Estimating the term…
A semiconductor device comprises a semiconductor layer including a mesa structure and a peripheral surface extending around the mesa structure, the mesa structure having a plateau shape with an upper surface and a side surface; a Schottky electrode forming a Schottky junction with the upper surface; an insulating film extending from the peripheral surface, across the side surface, and onto the Schottky electrode, the insulating film having an opening formed on the Schottky electrode; and a wiring electrode electrically connected to the Schottky electrode inside the opening, the wiring electrode extending from inside of the opening, across a portion of the insulating film formed on the side surface, and onto another portion of the insulating film formed on the peripheral surface.
A semiconductor device comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.