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US 2016/0254306 A1Published application
Method and Apparatus for Image Sensor Packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSzu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen, Jen-Cheng Liu
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Abstract
A backside illuminated image sensor having a photodiode and a first transistor in a sensor region and located in a first substrate, with the first transistor electrically coupled to the photodiode. The image sensor has logic circuits formed in a second substrate. The second substrate is stacked on the first substrate and the logic circuits are coupled to the first transistor through bonding pads, the bonding pads disposed outside of the sensor region.
Claims20
A device comprising:
- a sensor die comprising
- a sensor region;
- a plurality of pixels disposed within the sensor region;
- and
- a plurality of sensor bond pads disposed outside the sensor region, at least one of the plurality of sensor bond pads being exposed through a front side of the sensor die;
- and
- a control circuit die comprising:
- a plurality of control circuit bond pads, respective ones of the control circuit bond pads being bonded to respective ones of the plurality of sensor bond pads.
5 more elements
A device comprising:
- a sensor region formed in a sensor substrate;
- a plurality of backside illuminated pixels disposed within the sensor region;
- a plurality of sensor bond pads disposed outside the sensor region an on a front side of the sensor substrate, each of the plurality of sensor bond pads having an exposed surface;
- a row select line electrically connected to a plurality of pixels in a row, the row select line extending from within the sensor region to outside of the sensor region and being electrically connected to a sensor bond pad;
- and
- an output line electrically connected to a plurality of pixels in a column, the output line extending from within the sensor region to outside of the sensor region and being electrically connected to a second sensor bond pad.
3 more elements
A device, comprising:
- a sensor die including
- a sensor array within an sensor region,
- bond pads on a topmost surface thereof, the bond pads being configured in a pattern outside the sensor region, and
- an electrical connection structure electrically connecting respective pixels within the sensor array to respective bond pads,
- a control circuit die mounted to the sensor die and including
- a control circuit,
- second bond pads on a bottommost surface thereof, respective ones of the second bond pads being aligned with respective ones of the bond pads, and
- a second electrical connection structure electrically connecting respective nodes of the control circuit to respective second bond pads.
5 more elements
Dependencies are inferred from the claim text.