Adjacent device isolation
AssigneeQUALCOMM Incorporated
InventorsVladimir MACHKAOUTSAN, Mustafa BADAROGLU, Jeffrey Junhao XU, Stanley Seungchul SONG, Choh Fei YEAP
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AssigneeQUALCOMM Incorporated
InventorsVladimir MACHKAOUTSAN, Mustafa BADAROGLU, Jeffrey Junhao XU, Stanley Seungchul SONG, Choh Fei YEAP
Estimating the term…
An integrated circuit (IC) device may include a first active transistor of a first-type in a first-type region. The first active transistor may have a first-type work function material and a low channel dopant concentration in an active portion of the first active transistor. The IC device may also include a first isolation transistor of the first-type in the first-type region. The second active transistor may have a second-type work function material and the low channel dopant concentration in an active portion of the first isolation transistor. The first isolation transistor may be arranged adjacent to the first active transistor.
An integrated circuit (IC) device, comprising:
A method for altering a work function material of an isolation transistor within an integrated circuit (IC) device, the method comprising:
An integrated circuit (IC) device, comprising:
A method for altering a work function material of an isolation transistor within an integrated circuit (IC) device, the method comprising:
Dependencies are inferred from the claim text.