Power semiconductor module and composite module
AssigneeFuji Electric Co., Ltd.
InventorsMotohito HORI, Yoshinari IKEDA
Life of this patent
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Abstract
A power semiconductor module includes a wiring member that electrically connects a front surface electrode of a semiconductor element and a circuit board of an insulating substrate in a housing. A resin provided in the housing covers the wiring member, and has a height in the vicinity of the wiring member. A cover covering the periphery of external terminals is provided between the resin and a first lid in the housing. A second lid is provided further outside the first lid in an aperture portion of the housing, and the space between the second lid and the first lid is filled with another resin.
Claims14
A power semiconductor module, comprising:
- a housing having an aperture portion;
- a circuit board housed in an interior of the housing;
- a semiconductor element having an electrode on a front surface, a back surface being fixed to the circuit board;
- a wiring member electrically connecting the electrode of the semiconductor element and the circuit board;
- a first lid fixed in the aperture portion of the housing;
- a second lid fixed in the aperture portion of the housing and provided further outside the first lid;
- a first resin disposed between the first lid and the second lid;
- a second resin covering the wiring member and having an exposed surface, the exposed surface being located closer to the wiring member than the first lid;
- an external terminal having one end electrically and mechanically connected to the circuit board, and another end protruding further outside the second lid;
- and
- a cover covering the external terminal, and disposed between the exposed surface of the second resin and the first lid.
Dependencies are inferred from the claim text.