Method for Producing a Semiconductor Component and a Semiconductor Component

A semiconductor component:

• a light transmissive carrier;
• a semiconductor body disposed on the light transmissive carrier, the semiconductor body comprising a first semiconductor layer, a second semiconductor layer and an active region being arranged between the first semiconductor layer and the second semiconductor layer, wherein the semiconductor body comprises a first patterned main surface facing the light transmissive carrier and a second main surface facing away from the carrier;
• a contact structure comprising a first contact area and a second contact area arranged on the second main surface, wherein the second contact area is electrically connected to the second semiconductor layer, and wherein the contact structure comprises a via, the via being electrically connected to the first contact area and extending from the second main surface throughout the second semiconductor layer and the active region into the first semiconductor layer;
• and
• an insulating layer covering a vertical surface of the semiconductor body, wherein the insulating layer comprises a tether or a remnant of the tether,
• wherein the semiconductor component is free of a growth substrate.

A method for producing a plurality of semiconductor components, the method comprising:

• applying a semiconductor layer sequence on a substrate;
• structuring the semiconductor layer sequence by forming trenches thereby separating the semiconductor layer sequence into a plurality of semiconductor bodies;
• applying an insulating layer covering the trenches and vertical surfaces of the plurality of semiconductor bodies;
• forming a plurality of tethers by structuring the insulating layer in regions covering the trenches;
• locally detaching the substrate from the plurality of semiconductor bodies, wherein the tethers remain attached to the substrate;
• and
• selectively picking up each semiconductor body by separating the tethers from the substrate, wherein each semiconductor body comprises a portion of the semiconductor layer sequence.