Back to results
US 2016/0254252 A1Published application
Systems and methods for bonding semiconductor elements
AssigneeKulicke and Soffa Industries, Inc.
InventorsRobert N. Chylak, Dominick A. DeAngelis
Life of this patent
Estimating the term…
Abstract
A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
Claims9
A semiconductor device comprising:
- (a) a first semiconductor element including a plurality of first conductive structures, at least a contact portion of each of the plurality of first conductive structures including aluminum;
- and
- (b) a second semiconductor element including a plurality of second conductive structures, at least a contact portion of each of the plurality of second conductive structures including aluminum,
- wherein the contact portions of ones of the plurality of first conductive structures are in contact with, and are ultrasonically bonded to, respective ones of the contact portions of the plurality of second conductive structures.
1 more element
Dependencies are inferred from the claim text.