3D Semiconductor Package Interposer with Die Cavity

A device, comprising:

• a substrate having a top surface;
• an interposer over the top surface of the substrate, the interposer being connected to the substrate by a first plurality of connectors;
• a first integrated circuit die connected to a first side of the interposer by a second plurality of connectors;
• and
• a second integrated circuit die connected to a second side of the interposer opposite the first side by a third plurality of connectors and connected to the substrate by a fourth plurality of connectors.

A device, comprising:

• a substrate having a top surface;
• an interposer over the top surface of the substrate, the interposer being connected to the substrate by first interconnects;
• a first integrated circuit die connected to a first side of the interposer by first connectors;
• a second integrated circuit die connected to a second side of the interposer opposite the first side by second connectors, the second integrated circuit die having a smaller footprint than the interposer;
• and
• a fan-out structure disposed over a top surface of the interposer and extending beyond outermost edges of the interposer, wherein the fan-out structure is electrically connected to second interconnects, the second interconnects in contact with the top surface of the substrate.