Apparatus and method for bonding chips
AssigneesBoe Technology Group Co., Ltd., Beijing Boe Optoelectronics Technology Co., Ltd.
InventorsRui LI, Young Man KWON, Yong SONG
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Abstract
An apparatus and method for bonding chips (4) is disclosed. The apparatus for bonding chips (4) comprises: a base stage (1) and a press head (2), the side of the base stage (1) for carrying the substrates (3) has a first downward concave curvature, the side of the press head (2) contacting with the chips (4) has a second downward convex curvature, and the base stage (1) with the first curvature and the press head (2) with the second curvature match with each other. The warping problem of the bonded chips (4) and substrate (3) can be overcome.
Claims11
An apparatus for bonding chips, comprising a base stage and a press head, wherein,
- the side of the base stage for carrying the substrates comprises a first downward concave curvature, the side of the press head contacting with the chips comprises a second downward convex curvature, and the base stage having the first curvature and the press head having the second curvature match with each other.
A method for bonding chips, comprising:
- placing a substrate onto a base stage having a first downward concave curvature;
- coating the substrate with anisotropic conductive adhesive, placing the chips onto the anisotropic conductive adhesive and pre-fixing the same;
- bonding the chips onto the substrate by means of a press head having a second downward convex curvature;
- wherein, the base stage having the first curvature and the press head having the second curvature match with each other.
Dependencies are inferred from the claim text.