Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
AssigneeKulicke and Soffa Industries, Inc.
InventorMatthew B. Wasserman
Life of this patent
Estimating the term…
Abstract
A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.
Claims27
A bond head assembly for bonding a semiconductor element to a substrate, the bond head assembly comprising:
- a base structure;
- a heater;
- and
- a clamping system securing the heater to the base structure, the clamping system including a plurality of elastic elements constraining the heater along a plurality of axes.
A thermocompression bonder comprising:
- a semiconductor element supply station including a plurality of semiconductor elements;
- a bonding station for holding a substrate configured to receive at least one of the semiconductor elements;
- and
- a bond head assembly for bonding the at least one semiconductor element to the substrate, the bond head assembly including a base structure, a heater, and a clamping system for securing the heater to the base structure, the clamping system including a plurality of elastic elements constraining the heater along a plurality of axes.
A method of assembling a bond head assembly, the method comprising the steps of:
- securing a heater to a base structure using a clamping system;
- and
- constraining the heater along a plurality of axes of the bond head assembly with a plurality of elastic elements of the clamping system.
A method of operating a bond head assembly of a thermocompression bonding machine, the method comprising the steps of:
- securing a heater to a base structure using a clamping system, the clamping system including a plurality of elastic elements constraining the heater along a plurality of axes;
- and
- operating the heater in connection with a thermocompression bonding process.
Dependencies are inferred from the claim text.