Systems and Methods Utilizing Anisotropic Conductive Adhesives
AssigneeSunRay Scientific, Inc.
InventorS. Kumar Khanna
Life of this patent
Estimating the term…
Abstract
Illustrative embodiments of systems and method utilizing anisotropic conductive adhesive(s) (“ACA”) are disclosed. In at least one illustrative embodiment, a substrate may comprise one or more electrical contacts, and one or more integrated circuits may be secured to the substrate by ACA. The ACA may comprise a plurality of particles suspended in a binder, where the plurality of particles form electrically conductive and isolated parallel paths between the one or more electrical contacts and the one or more integrated circuits as a result of the ACA being subjected to a magnetic field before or during curing of the binder.
Claims20
Apparatus comprising:
- a substrate comprising one or more electrical contacts;
- and
- one or more integrated circuits secured to the substrate by an anisotropic conductive adhesive (ACA);
- wherein the ACA comprises a plurality of particles suspended in a curable binder, the plurality of particles forming electrically conductive and isolated parallel paths between the one or more electrical contacts and the one or more integrated circuits as a result of the ACA being subjected to a magnetic field before or during curing of the binder.
Dependencies are inferred from the claim text.