Joining silver sheet, method for manufacturing same, and method for joining electronic part
AssigneeDowa Electronics Materials Co., Ltd.
InventorsSatoru KURITA, Keiichi ENDOH, Hiromasa MIYOSHI
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AssigneeDowa Electronics Materials Co., Ltd.
InventorsSatoru KURITA, Keiichi ENDOH, Hiromasa MIYOSHI
Estimating the term…
A joining silver sheet with high joining strength contains silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and has a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of from TA to TB (° C.) satisfying 270 £ TA<TB £ 350. A method of making the silver sheet includes subjecting a coated film of a silver paste containing silver powder containing silver particles having a particle diameter of from 1 to 250 nm, and a dispersion medium that undergoes volatilization in a temperature range of 200° C. or lower, which are mixed with each other, to a heat treatment at a temperature range, at which no sintering occurs, and then baking at a temperature of from 170 to 250° C. under application of a pressure of from 5 to 35 MPa.
A joining silver sheet comprising silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and having a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of “TA (° C.) or higher and TB (° C.) or lower” satisfying the following expression (1):
A method for manufacturing a joining silver sheet, comprising:
Dependencies are inferred from the claim text.