Method of manufacturing micro pins and isolated conductive micro pin
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYing-Jui HUANG, Chung-Shi LIU, Hsin-Hung LIAO, Chien-Ling HWANG
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Abstract
A method of manufacturing micro pins includes forming a release layer over a substrate. A pattern layer is formed over the release layer, in which the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer. A plurality of micro pins are respectively formed in the openings. The pattern layer and the release layer are removed to obtain the micro pins. An isolated conductive micro pin for connecting one or more components is also provided.
Claims20
A method of manufacturing micro pins, comprising:
- forming a release layer over a substrate;
- forming a pattern layer over the release layer, wherein the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer;
- forming a plurality of micro pins respectively in the openings;
- and
- removing the pattern layer and the release layer to obtain the micro pins.
A method of manufacturing micro pins, comprising:
- providing a pattern layer, the pattern layer having a plurality of openings spaced apart to each other;
- forming a plurality of micro pins respectively in the openings;
- and
- removing the pattern layer to obtain the micro pins.
An isolated conductive micro pin for connecting one or more components, comprising:
- a body with a fixed or substantially fixed thickness, the body having at least two ends, wherein each of the ends has a quadrangular or substantially quadrangular surface.
Dependencies are inferred from the claim text.