Packaging Devices and Methods of Manufacture Thereof

A method of manufacturing a packaging device, the method comprising:

• forming a contact pad over a substrate;
• forming a passivation layer over the substrate and the contact pad;
• etching an opening in the passivation layer to expose a first portion of the contact pad, wherein a second portion of the contact pad is not exposed;
• forming a post passivation interconnect (PPI) line over the passivation layer, the PPI line being coupled to the first portion of the contact pad;
• forming a PPI pad over the passivation layer;
• forming a transition element over the passivation layer, the transition element being coupled between the PPI line and the PPI pad;
• and
• forming an extension element over the passivation layer, the extension element comprising a ring member around the circumference of the PPI pad and radial members extending from the ring member to the PPI pad.

A method of manufacturing a packaging device, the method comprising:

• forming a contact pad over a substrate;
• forming a passivation layer over the substrate and the contact pad;
• removing a portion of the passivation layer to expose a first portion of the contact pad, leaving a second portion of the contact pad covered by the passivation layer;
• forming a post passivation interconnect (PPI) line over the passivation layer, the PPI line having a width of about 10 to about 100 μm;
• forming a PPI pad over the passivation layer;
• forming a transition element, the transition element having a hollow region formed therein, and the transition element being coupled between the PPI line and the PPI pad, wherein a distance between the PPI line and the PPI pad comprises about 150 μm or less;
• forming a conductive material over the PPI pad;
• and
• re-flowing the conductive material to form a wetting region over a portion of the transition element, wherein the wetting region is not formed on the PPI line.