Radio-frequency (rf) shielding in fan-out wafer level package (fowlp)

A device, comprising:

• a fan-out wafer level package (FOWLP) comprising a plurality of conductor portions and a plurality of dielectric portions, the FOWLP having a substantially flat first surface over the conductor portions and the dielectric portions;
• a first chip comprising a first plurality of contacts in direct contact with the FOWLP;
• a second chip comprising a second plurality of contacts in direct contact with the FOWLP, the first chip and the second chip spaced apart by a gap, and at least one of the conductor portions of the FOWLP positioned directly opposite the gap between the first chip and the second chip;
• and
• a conductor shield comprising a plurality of conductor surfaces, at least one of the conductor surfaces directly connected to the at least one of the conductor portions of the FOWLP directly opposite the gap between the first chip and the second chip, at least one of the conductor surfaces immediately surrounding the first chip, and at least one of the conductor surfaces immediately surrounding the second chip,
• wherein a bottom surface of the first chip including bottom surfaces of the first plurality of contacts, a bottom surface of the second chip including bottom surfaces of the second plurality of contacts, and the at least one of the conductor surfaces directly connected to the at least one of the conductor portions of the FOWLP directly opposite the gap between the first chip and the second chip are substantially flush with each other.

A device, comprising:

• a fan-out wafer level package (FOWLP) comprising a plurality of conductor portions and a plurality of insulator portions, the FOWLP having a substantially flat first surface over the conductor portions and the insulator portions;
• a first chip comprising a first plurality of contacts in direct contact with the FOWLP;
• a second chip comprising a second plurality of contacts in direct contact with the FOWLP, wherein the first chip and the second chip are spaced apart by a gap, and wherein at least one of the conductor portions of the FOWLP is positioned directly opposite the gap between the first chip and the second chip;
• and
• means for ground shielding the first chip and the second chip,
• wherein a bottom surface of the first chip including bottom surfaces of the first plurality of contacts and a bottom surface of the second chip including bottom surfaces of the second plurality of contacts are substantially flush with each other.

A method of making a device, comprising:

• providing a reconstitution tape having a first surface;
• providing a first plurality of contacts and a second plurality of contacts on the first surface of the reconstitution tape;
• providing a first chip having a first plurality of contact openings to receive the first plurality of contacts on the first surface of the reconstitution tape;
• providing a second chip having a second plurality of contact openings to receive the second plurality of contacts on the first surface of the reconstitution tape, wherein the first chip and the second chip are spaced apart by a gap exposing at least one portion of the first surface of the reconstitution tape;
• and
• providing a conductor shield comprising a plurality of conductor surfaces, wherein at least one of the conductor surfaces is in direct contact with the at least one portion of the first surface of the reconstitution tape exposed by the gap between the first chip and the second chip, wherein at least one of the conductor surfaces immediately surrounds the first chip, and wherein at least one of conductor surfaces immediately surrounds the second chip.