Compartment shielding in flip-chip (fc) module

A device, comprising:

• an interposer comprising a plurality of conductor portions and a plurality of dielectric portions, the interposer having a substantially flat first surface over the plurality of conductor portions and the plurality of dielectric portions;
• a first plurality of flip-chip bumps and a second plurality of flip-chip bumps disposed on the first surface of the interposer;
• a first chip disposed on the first plurality of flip-chip bumps;
• a second chip disposed on the second plurality of flip-chip bumps, wherein the first chip and the second chip are spaced apart by a gap on the first surface of the interposer, and wherein at least one of the plurality of conductor portions of the interposer is positioned directly opposite the gap between the first chip and the second chip;
• and
• a unitary conductor shield comprising a plurality of conductor surfaces, wherein a first one of the plurality of conductor surfaces is directly connected to said at least one of the plurality of conductor portions of the interposer at the first surface of the interposer directly opposite the gap between the first chip and the second chip, wherein a second one of the plurality of conductor surfaces immediately surrounds and directly contacts the first chip, and wherein a third one of the plurality of conductor surfaces immediately surrounds the second chip.

A device, comprising:

• a substrate comprising a plurality of conductor portions and a plurality of insulator portions, the substrate having a substantially flat first surface over the conductor portions and the plurality of insulator portions;
• a first plurality of bumps and a second plurality of bumps disposed on the first surface of the substrate;
• a first chip disposed on the first plurality of bumps;
• a second chip disposed on the second plurality of bumps, wherein the first chip and the second chip are spaced apart by a gap on the first surface of the substrate, and wherein at least one of the conductor portions of the substrate is positioned directly opposite the gap between the first chip and the second chip;
• a first capillary under-fill (CUF) disposed between the first chip and the substrate;
• a second CUF disposed between the second chip and the substrate;
• and
• means for ground shielding the first chip and the second chip wherein the means for ground shielding is a unitary body and a portion of the means for ground shielding directly contacts the first chip as well as at least one of the plurality of conductor portions at the first surface of the substrate in the gap.

A method of making a device, comprising:

• providing a substrate comprising a plurality of conductor portions and a plurality of insulator portions;
• providing a first solder mask and a second solder mask on the substrate, wherein the first and second solder masks are separated by an opening to expose at least one of the conductor portions of the substrate;
• providing a first plurality of bumps and a second plurality of bumps on the substrate;
• providing a first chip on the first plurality of bumps and a second chip on the second plurality of bumps, the first chip and the second chip spaced apart by a gap directly opposite said at least one of the conductor portions of the substrate exposed by the opening between the first solder mask and the second solder mask;
• and
• providing a unitary conductor shield comprising a plurality of conductor surfaces, wherein a first one of the plurality of conductor surfaces is directly connected to said at least one of the conductor portions of the substrate exposed by the opening between the first solder mask and the second solder mask, wherein a second one of the plurality of conductor surfaces immediately surrounds and directly contacts the first chip, and wherein a third one of the plurality of conductor surfaces immediately surrounds the second chip.